Plaintiff: Chip
Packaging Solutions (CPS)
Defendant: Qualcomm
Inc. and Qualcomm Technologies Inc.
A patent infringement case (8:13-cv-00482)
was filed by Chip Packaging Solutions against Qualcomm on Mar 26 in the
California Central District Court. The patent involved in this suit is US5838072
entitled ‘Intrachip power distribution
package and method for semiconductors having a supply node electrically
interconnected with one or more intermediate nodes’ was issued on Nov 17,
1998 and expires[i] on Feb
24, 2017. The patent is currently assigned[ii]
to Patent Business Development (source: MaxVal’s Assignment
Database).
The '072 patent relates to a
structure of an integrated circuit package that is comprised of a semiconductor
die, a supply node electrically connected to a power source, intermediate
nodes, and respective conductive leads lying external to and within the
periphery of the die.
As per the complaint, CPS is the exclusive and current owner of
the patent. CPS alleges that Qualcomm manufactures products and systems
comprising semiconductor chip packages including Qualcomm MDM8220 Multi Chip
Package Mobile Data Modem that embody the claims covered in ‘072 patent.
On the same day, CPS has filed other cases asserting the same
patent against the following:
- Texas Instruments (8:13-cv-00479)
- SanDisk Corporation (8:13-cv-00481)
- Epson Electronics America (8:13-cv-00483)
If you are interested in knowing more about the cases filed,
please contact us. To get alerts on cases filed,
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[i] Expected expiration date. Patent Term
Estimator is a free web-based tool that automatically calculates patent terms and
expiration dates for U.S. utility patents.
[ii] MaxVal offers Patent Assignment Alert service where subscribers
receive email alerts when assignments relating to target applications, patents
or entities of interest are recorded.
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