Sunday, June 16, 2013

Semcon, IBM Put Patent Case to Rest

Case Filed: Feb 26, 2013

Case Closed: Jun 11, 2013

Court: Delaware District Court

Judge: Richard G. Andrews

Case Summary:
A patent infringement case was filed by Semcon against IBM claiming that their patents were infringed. The patents involved in this suit are:

  • US6541381 - Finishing method for semiconductor wafers using a lubricating boundary layer, issued in Apr 01, 2003
  • US6656023 - In situ control with lubricant and tracking, issued in Dec 02, 2003

The patents expire[1] by Nov 05, 2019 and are currently assigned[2] to Semcon Tech (source: MaxVal’s Assignment Database). Plaintiff alleged that defendant manufactures integrated circuits that are fabricated using a process of chemical-mechanical polishing (CMP) with the use of an Ebara F-REX 300 CMP system and Applied Materials Reflexion LK CMP system with a fixed abrasive pad that are patented under the ‘381 and ‘023 patents. Semcon sought a judgment in favor and all other relief to which the Court may deem the plaintiff be entitled.

The proceedings were ongoing and on Jun 7, the parties having reached an agreement, filed joint motion to dismiss. Following the dismissal filed, Judge Richard G. Andrews ordered claims and counterclaims asserted in the case be dismissed with prejudice and each party to bear the costs and expenses incurred.

See 1:13-cv-00316 for more details. To get alerts on cases filed/closed, subscribe to our Litigation Alerts.

Patent Term Estimator, use our free tool or download our free Android app on Google Play Store.

[1] Expected expiration date. Patent Term Estimator is a free web-based tool that automatically calculates patent terms and expiration dates for U.S. utility patents.
[2] MaxVal offers Patent Assignment Alert service where subscribers receive email alerts when assignments relating to target applications, patents or entities of interest are recorded.

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