Case Filed: Feb 26, 2013
Case Closed: Jun 11, 2013
Court: Delaware District Court
Judge: Richard G. Andrews
Case Summary:
A patent infringement case was filed by Semcon against IBM
claiming that their patents were infringed. The patents involved in this suit
are:
- US6541381 - Finishing method for semiconductor wafers using a lubricating boundary layer, issued in Apr 01, 2003
- US6656023 - In situ control with lubricant and tracking, issued in Dec 02, 2003
The patents expire[1] by
Nov 05, 2019 and are currently assigned[2] to
Semcon Tech (source: MaxVal’s Assignment Database). Plaintiff alleged that
defendant manufactures integrated circuits that are fabricated using a process of
chemical-mechanical polishing (CMP) with the use of an Ebara F-REX 300 CMP
system and Applied Materials
Reflexion LK CMP system with a fixed abrasive pad
that are patented under the ‘381 and ‘023 patents. Semcon sought a
judgment in favor and all other relief to which the Court may deem the
plaintiff be entitled.
The proceedings were ongoing and on Jun 7, the parties having
reached an agreement, filed joint motion to dismiss. Following the dismissal
filed, Judge Richard G. Andrews ordered claims and counterclaims asserted in
the case be dismissed with prejudice and each party to bear the costs and
expenses incurred.
See 1:13-cv-00316
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[1] Expected expiration date. Patent Term Estimator is a free web-based tool that automatically
calculates patent terms and expiration dates for U.S. utility patents.
[2] MaxVal offers Patent Assignment Alert service
where subscribers receive email alerts when assignments relating to target
applications, patents or entities of interest are recorded.
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