Court: Delaware District Court
Judge: Richard G. Andrews
Case Summary:
Semcon Tech, a Texas-based
company filed two patent infringement cases in Apr 2012 and Feb 2013 claiming
that their patents were infringed. The patents involved in the two cases were:
US7156717 – Situ finishing
aid control was issued on Jan 02, 2007 and expires* by Sep 20, 2021.
US6656023 – In situ control
with lubricant and tracking was issued on Dec 02, 2003 and expires*
by Nov 05, 2019.
The patents are currently
assigned+
to Semcon Tech (source: MaxVal’s Assignment
Database). Plaintiff alleged that Samsung manufactures integrated circuits that
are fabricated using a process of chemical-mechanical polishing (CMP) with the
use of an Ebara F-REX 300 CMP system and Applied Materials Reflexion CMP system
with a fixed abrasive pad that claimed by the
‘717 and ‘023 patents. The lawsuits do not specifically mention any products of
the defendant that allegedly violate the patents. Semcon sought a judgment in
favor and all other relief to which the Court may deem the plaintiff be
entitled.
The parties on Jun 26 reported to Court
that they have settled the dispute amongst themselves and filed dismissal for
both the cases. Upon consideration, the Judge ordered the case dismissed with
prejudice, with each party to bear their own costs and expenses. Terms of
settlement were not disclosed.
Semcon Tech
has also filed patent infringement suits against several chip makers, including
IBM, Intel, Fujifilm electronics, Texas Instruments and Micron. IBM settled the
case with Semcon recently on Jun 16.
See 1:12-cv-00533and
1:13-cv-00317
for more details. To get alerts on
cases filed/closed, subscribe to our Litigation Alerts.
*
Expected expiration date. Patent Term Estimator is a free web-based
tool that automatically calculates patent terms and expiration dates for
U.S. utility patents
+
MaxVal offers Patent Assignment Alert service where
subscribers receive email alerts when assignments relating to target
applications, patents or entities of interest are recorded.
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